o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No 2016-2017 Microchip Technology Inc. DS00002117F-page 68 KSZ9031RNX 13.0 Note: PACKAGE OUTLINES For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging FIGURE 13-1: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 3.5 MM X 3.5 MM EXPOSED PAD AREA 2016-2017 Microchip Technology Inc. DS00002117F-page 69 KSZ9031RNX FIGURE 13-2: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD AREA TITLE 48 LEAD QFN 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN77-48LD-PL-1 UNIT MM 7.000.05 5.100.05 Exp.DAP 48 PIN #1 ID CHAMFER 0.35x45 0.400.05 1 2 0.50 Bsc 5.100.05 Exp.DAP 7.000.05 0.250.05 5.50 Ref. Top View Bottom View NOTE: 1, 2, 3 N
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Yes Pulse JK0654219NL Yes 0C to 70C Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No DS00002329B-page 218 2017 Microchip Technology Inc. KSZ9567R 8.0 PACKAGE INFORMATION 8.1 Package Marking Information 128-TQFP-EP MICROCHIP KSZ9567RTXt e3 Rnnn e3 VVVCO YYWWNNN Legend: Note: t R nnn e3 VVV CO YY WW NNN Temperature range designator (I = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Plant assembly Country of origin Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard device marking c
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No Table 25. Compatible Single-Port 10/100/1000 Magnetics August 8, 2013 74 Revision 2.0 Micrel, Inc. KSZ9031RNX Package Information(1) 48-Pin (7mm x 7mm) QFN Note: 1. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com. August 8, 2013 75 Revision 2.0 Micrel, Inc. KSZ9031RNX Recommended Landing Pattern Red circles indicate thermal vias. They should be 0.350mm in diameter and be connected to the GND plane for maximum thermal performance. Green rectangles (with shaded area) indicate solder stencil openings on the exposed pad area. They should be 0.93x0.93mm in size, 1.13mm pitch. MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 9
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No DS00002117D-page 68 2016-2017 Microchip Technology Inc. KSZ9031RNX 13.0 Note: PACKAGE OUTLINES For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging FIGURE 13-1: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 3.5 MM X 3.5 MM EXPOSED PAD AREA 2016-2017 Microchip Technology Inc. DS00002117D-page 69 KSZ9031RNX FIGURE 13-2: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD AREA TITLE 48 LEAD QFN 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN77-48LD-PL-1 UNIT MM 7.000.05 5.100.05 Exp.DAP 48 PIN #1 ID CHAMFER 0.35x45 0.400.05 1 2 0.50 Bsc 5.100.05 Exp.DAP 7.000.05 0.250.05 5.50 Ref. Top View Bottom View NOTE: 1, 2, 3 N
nless otherwise specified: Tolerances: Fractions: +1/64 Angles: +1* Decimals: +.005[.127] This drawing is dual dimensioned. Dimensions in brackets are in millimeters. TRANSFORMER eiSos p/n: PDFP-G24 DA DRAWING NO. dieormm -|/]5 == www.midcominc.com _LA47? 000-7093-37R-LF1 REVISIONS: SEE SHEET 1 SCALE --- | SHEET 2 OF 10 6>
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No May 14, 2015 81 Revision 2.2 Micrel, Inc. KSZ9031MNX Package Information(11) and Recommended Landing Pattern 64-Pin (8mm x 8mm) QFN Note: 11. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com. May 14, 2015 82 Revision 2.2 Micrel, Inc. KSZ9031MNX MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel, Inc. is a leading global manufacturer of IC solutions for the worldwide high performance linear and power, LAN, and timing & communications markets. The Company's products include advanced mixed-signal, analog & power semiconductors; high-performance communication, cloc
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Yes Pulse JK0654219NL Yes 0C to 70C Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No DS00002392A-page 240 2017 Microchip Technology Inc. KSZ9477S 8.0 PACKAGE INFORMATION 8.1 Package Marking Information 128-TQFP-EP MICROCHIP KSZ9477STXt e3 Rnnn e3 VVVCO YYWWNNN Legend: Note: t R nnn e3 VVV CO YY WW NNN Temperature range designator (I = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Plant assembly Country of origin Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard device marking c
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No Table 25. Compatible Single-Port 10/100/1000 Magnetics October 2012 74 M9999-103112-1.0 Micrel, Inc. KSZ9031MNX Recommended Land Pattern Figure 25. Recommended Land Pattern, 64-Pin (8mm x 8mm) QFN Red circles indicate thermal vias. They should be 0.350mm in diameter and be connected to the GND plane for maximum thermal performance. Green rectangles (with shaded area) indicate solder stencil openings on the exposed pad area. They should be 0.93x0.93mm in size, 1.13mm pitch. October 2012 75 M9999-103112-1.0 Micrel, Inc. KSZ9031MNX Package Information 64-Pin (8mm x 8mm) QFN MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel makes no re
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No DS00002096E-page 66 2016-2017 Microchip Technology Inc. KSZ9031MNX 13.0 Note: PACKAGE OUTLINES For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging FIGURE 13-1: 64-LEAD QFN 8 MM X 8 MM PACKAGE WITH 4.2 MM X 4.2 MM EXPOSED PAD AREA 2016-2017 Microchip Technology Inc. DS00002096E-page 67 KSZ9031MNX FIGURE 13-2: DS00002096E-page 68 64-LEAD QFN 8 MM X 8 MM PACKAGE WITH 6.5 MM X 6.5 MM EXPOSED PAD AREA 2016-2017 Microchip Technology Inc. KSZ9031MNX APPENDIX A: TABLE A-1: DATA SHEET REVISION HISTORY REVISION HISTORY Revision Section/Figure/Entry Correction DS00002096E (06-02-17) Table 2-1, "Signals KSZ9031MNX" Added the following note to
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Yes Pulse JK0654219NL Yes 0C to 70C Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No 2017 Microchip Technology Inc. DS00002330B-page 183 KSZ9897R 8.0 PACKAGE INFORMATION 8.1 Package Marking Information 128-TQFP-EP MICROCHIP KSZ9897RTXt e3 Rnnn e3 VVVCO YYWWNNN Legend: Note: t R nnn e3 VVV CO YY WW NNN Temperature range designator (C = commercial, I = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Plant assembly Country of origin Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard
0C to 70C No TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No DS00002841B-page 140 2018-2019 Microchip Technology Inc. KSZ9131RNX 7.0 PACKAGE OUTLINE Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging FIGURE 7-1: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD AREA TITLE 48 LEAD QFN 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # QFN77-48LD-PL-1 UNIT MM 7.000.05 5.100.05 Exp.DAP 48 PIN #1 ID CHAMFER 0.35x45 0.400.05 1 2 0.50 Bsc 5.100.05 Exp.DAP 7.000.05 0.250.05 5.50 Ref. Top View Bottom View NOTE: 1, 2, 3 NOTE: 1, 2, 3 0.850.05 0.00-0.05 0.253 (REF) Side View NOTE: 1, 2, 3 NOTE: 1. MAX PACKAGE WARPAGE IS 0.05mm. 2. MAX ALLOWABLE BURR IS 0.076mm IN ALL DIRE
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Yes Pulse JK0654219NL Yes 0C to 70C Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No 2017 Microchip Technology Inc. DS00002390A-page 187 KSZ9896C 8.0 PACKAGE INFORMATION 8.1 Package Marking Information 128-TQFP-EP MICROCHIP KSZ9896CTXt e3 Rnnn e3 VVVCO YYWWNNN Legend: Note: t R nnn e3 VVV CO YY WW NNN Temperature range designator (C = commercial, I = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Plant assembly Country of origin Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Yes Pulse JK0654219NL Yes 0C to 70C Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No DS00002394A-page 188 2017 Microchip Technology Inc. KSZ9897S 8.0 PACKAGE INFORMATION 8.1 Package Marking Information 128-TQFP-EP MICROCHIP KSZ9897STXt e3 Rnnn e3 VVVCO YYWWNNN Legend: Note: t R nnn e3 VVV CO YY WW NNN Temperature range designator (C = commercial, I = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Plant assembly Country of origin Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Pulse JK0654219NL Yes 0C to 70C Yes Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No Table 25. Compatible Single-Port 10/100/1000 Magnetics October 2012 73 M9999-103112-1.0 Micrel, Inc. KSZ9031RNX Recommended Land Pattern Figure 21. Recommended Land Pattern, 48-Pin (7mm x 7mm) QFN Red circles indicate thermal vias. They should be 0.350mm in diameter and be connected to the GND plane for maximum thermal performance. Green rectangles (with shaded area) indicate solder stencil openings on the exposed pad area. They should be 0.93x0.93mm in size, 1.13mm pitch. October 2012 74 M9999-103112-1.0 Micrel, Inc. KSZ9031RNX Package Information 48-Pin (7mm x 7mm) QFN MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel makes no re
o 70C No HALO TG1G-S002NZRL Yes 0C to 70C No Pulse H5007NL Yes 0C to 70C No Pulse H5062NL Yes 0C to 70C No Pulse HX5008NL Yes -40C to 85C No Yes Pulse JK0654219NL Yes 0C to 70C Pulse JK0-0136NL No 0C to 70C Yes TDK TLA-7T101LF No 0C to 70C No Wurth/Midcom 000-7093-37R-LF1 Yes 0C to 70C No 2017-2019 Microchip Technology Inc. DS00002390C-page 189 KSZ9896C 8.0 PACKAGE INFORMATION 8.1 Package Marking Information 128-TQFP-EP MICROCHIP KSZ9896CTXt e3 Rnnne3 YYWWNNN Legend: Note: t R nnn e3 YY WW NNN Temperature range designator (C = commercial, I = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard device marking consists of Microchip part